CU155A Copper Powder
Copper Powder 99.5% – 99.9%
Very high purity, air atomized, hydrogen reduced ultra fine copper powder. Spherical particle. High conductivity. High Density.
Additional Description
Recommended for:
- Thick and Thin Film pastes
- Capacitor Chips
- End cap Terminators
- Conductive Inks, paints and pastes
- Injection Molding
- Electronics
- Thermal management
- EDM Electrodes
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
Typical Analysis:
Copper: 99.81%
Iron: 0.01%
Hydrogen Loss: 0.18%
Apparent Density: 4.89 g/cc
SIEVE ANALYSIS
+200 MESH: 0%
-200+325 MESH: 4.8%
-325 MESH: 95.2%