CU155A Copper Powder

CU155A Copper Powder

Copper Powder 99.5% – 99.9%

Very high purity, air atomized, hydrogen reduced ultra fine copper powder. Spherical particle. High conductivity. High Density.

Additional Description

Recommended for:

  • Thick and Thin Film pastes
  • Capacitor Chips
  • End cap Terminators
  • Conductive Inks, paints and pastes
  • Injection Molding
  • Electronics
  • Thermal management
  • EDM Electrodes
  • Thermal Sprays
  • Sintered alloys/ products
  • Brazing/ soldering paste

Typical Analysis:
Copper: 99.81%
Iron: 0.01%
Hydrogen Loss: 0.18%
Apparent Density: 4.89 g/cc
SIEVE ANALYSIS
+200 MESH: 0%
-200+325 MESH: 4.8%
-325 MESH: 95.2%

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